Situasi Semasa dan Perkembangan Papan Bercetak Berbilang Lapisan

Since the middle and late 1980s, the output value and output of multi-layer boards have increased by more than 10 percent (compared with the previous year) every year. Due to the rapid development of components to "light, thin, short and small", Multilayer boards are bound to become the most influential and vital category in the printed circuit board industry, and become the leading product. Multilayer board structures will be diversified, thin and high-rise, and MCM-L structure will be faster Development. Multi-layer boards require high investment in equipment and technology. In the future, high-level multi-layer boards will be developed and produced in large PCB factories with strong strength

Aliran pembangunan papan berbilang-pada masa hadapan:

ketumpatan tinggi

Stratifikasi berbilang (tinggi) nipis

Kepelbagaian struktur papan berbilang-lapisan

Bahan asas nipis untuk kerajang tembaga nipis berprestasi tinggi

Kerataan permukaan tinggi dan teknologi salutan permukaan

Papan Berbilang Lapisan Fleksibel dan-Papan Berbilang Lapisan Fleksibel