Aliran proses substrat aluminium

1. Pembukaan

Proses pengeluaran substrat aluminium

1. Proses pemotongan bahan - pemotongan

2. Tujuan pembukaan

Potong-bahan masuk bersaiz besar mengikut saiz yang diperlukan untuk pengeluaran

3. Langkah berjaga-jaga untuk membuka bahan

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Menggerudi

1. Proses penggerudian

Dowel - Penggerudian - Papan Pemeriksaan

2. Tujuan penggerudian

Kedudukan dan penggerudian plat untuk membantu proses pengeluaran seterusnya dan pemasangan pelanggan

3. Langkah berjaga-jaga untuk penggerudian

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Gerudi kedua: lubang alat dalam unit selepas topeng pateri

3. Pengimejan filem kering/basah

1. Proses pengimejan filem kering/basah

Pembangunan dedahan filem - plat pengisaran - -.

2. Tujuan pengimejan filem kering/basah

Bahagian yang diperlukan untuk membuat litar ditunjukkan pada helaian

3. Langkah berjaga-jaga untuk pengimejan filem kering/basah

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Goresan Asid/Alkali

1. Proses goresan asid/Alkali

Mengukir - melucutkan - mengeringkan - papan pemeriksaan

2. Tujuan goresan asid/alkali

Selepas pengimejan filem kering/basah, simpan bahagian litar yang diperlukan, keluarkan bahagian yang berlebihan di luar litar, dan beri perhatian kepada kakisan substrat aluminium oleh larutan etsa semasa goresan asid;

3. Langkah berjaga-jaga untuk etsa asid/alkali

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Lima, topeng pateri skrin sutera, watak

1. Topeng pateri skrin sutera, proses watak

Silkscreen - Pra-baking - Pendedahan - Pembangunan - Aksara

2. Tujuan topeng pateri skrin sutera dan watak

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Perkara yang memerlukan perhatian untuk topeng pateri skrin sutera dan watak

① To check whether there is garbage or foreign matter on the board

substrat aluminium COB

substrat aluminium COB

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-POTONG, papan gong

1. V-CUT, proses papan gong

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, tujuan papan gong

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Langkah berjaga-jaga untuk V-CUT dan papan gong

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Tujuh, ujian, OSP

1. Ujian, proses OSP

Ujian Talian - Ujian Voltan Tahan - OSP

2. Pengujian, tujuan OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, ujian, langkah berjaga-jaga OSP

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Lapan, FQC, FQA, pembungkusan, penghantaran

1. Proses

FQC - FQA - Pembungkusan - Penghantaran

2. Tujuan

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Beri perhatian

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3